Substrate processing apparatus, liquid processing method, and storage medium

A substrate processing apparatus that removes a film on a peripheral edge of a substrate by supplying a processing liquid to the substrate, the substrate processing apparatus comprising:

• a substrate holding unit configured to hold the substrate and including a rotation mechanism configured to rotate the substrate;
• an ejection unit configured to eject the processing liquid to the peripheral edge of the substrate held by the substrate holding unit;
• an ejection position setting unit configured to set an ejection position of the processing liquid to correspond to a removal width of the film included in an input recipe;
• a movement mechanism configured to move the ejection position of the processing liquid from the ejection unit toward a diametric direction of the substrate based on the ejection position set by the ejection position setting unit;
• a property information acquisition unit configured to acquire property information of the film to be removed;
• a correction amount acquisition unit configured to acquire a correction amount for correcting the ejection position set by the ejection position setting unit, based on the property information of the film acquired by the property information acquisition unit;
• and
• an ejection position correction unit configured to correct the ejection position set by the ejection position setting unit, based on the correction amount acquired by the correction amount acquisition unit.