Ceramic electronic component

A ceramic electronic component comprising:

• a laminated body including a plurality of ceramic layers and a plurality of conductor layers that are stacked alternately;
• and
• first and second external electrodes provided on portions of the laminated body, and electrically connected to at least some conductor layers of the plurality of conductor layers;
• wherein
• the laminated body includes a first end surface and a second end surface opposing each other in a length direction, a first principal surface and a second principal surface opposing each other in a height direction, the first and second principal surfaces connecting the first end surface and the second end surface, and a first side surface and a second side surface opposing each other in a width direction, the first and second side surfaces connecting the first principal surface and the second principal surface and connecting the first end surface and the second end surface;
• a height of the laminated body in the height direction is larger than a width of the laminated body in the width direction;
• the first and second external electrodes each includes a sintered metal layer provided on the laminated body, a conductive resin layer including a mixture of a resin and a metal, the conductive resin layer provided on the sintered metal layer, and a plated layer provided on the conductive resin layer;
• the first external electrode extends from the first end surface to at least a portion of the second principal surface, a portion of the first side surface, and a portion of the second side surface;
• the second external electrode extends from the second end surface to at least a portion the second principal surface, a portion of the first side surface, and a portion of the second side surface;
• the laminated body includes a first outer layer portion and a second outer layer portion having a height that is greater than a height of the first outer layer portion;
• the second outer layer portion includes an outside outer layer portion and an inside outer layer portion;
• a Si content ratio at a boundary portion between the outside outer layer portion and the inside outer layer portion is higher than that in a central portion of the outside outer layer portion;
• an edge of the conductive resin layer of each of the first and second external electrodes disposed on the respective portion of at least one of the first and second side surfaces has a curved shape;
• and
• the conductive resin layer includes a conductive filler including conductive particles having a flattened or spherical shape.