Method of Producing Multi-Layer Ceramic Electronic Component and Multi-Layer Ceramic Electronic Component

A multi-layer ceramic electronic component, comprising:

• a multi-layer chip including
• ceramic layers laminated in a first axis direction,
• internal electrodes disposed between the ceramic layers, and
• a side surface on which the internal electrodes are exposed;
• and
• a side margin that is made of dielectric ceramics and provided on the side surface, the side margin including
• a flat portion having a predetermined thickness in a second axis direction, the second axis direction being orthogonal to the side surface, and
• a circumferential portion that is formed around the flat portion and has a thickness smaller than the thickness of the flat portion in the second axis direction.