Inductor winding and method for preparing a layout of a Multi-Layer Spiral Inductor winding
AssigneeXytech Electronic Technology (Shanghai) Co., Ltd.
InventorRaphaël Jacques VALENTIN
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AssigneeXytech Electronic Technology (Shanghai) Co., Ltd.
InventorRaphaël Jacques VALENTIN
Estimating the term…
A multi-layer spiral inductor winding comprises a plurality of conductive layers, each conductive layer includes a plurality of conductive traces which can be a conductive spiral of at least a fraction of one turn; an additional conductive layer, wherein the additional conductive layer includes a conductive trace, wherein the conductive bridge connects a second terminal electrode of the inductor winding to a conductive trace of the plurality of conductive layers; and wherein a first terminal electrode of the inductor winding belongs to another conductive trace of the plurality of conductive layers; and each distinct conductive trace is electrically connected to each other in order to form a multi-layer spiral inductor winding. The winding may be prepared by adopting a semiconductor process or a PCB process. The winding has the benefits of a high inductance value, a reduced parasitic coupling capacitance, and a high Q-factor.
A multi-layer spiral inductor winding comprising:
A preparation method of a multi-layer spiral inductor winding, comprising:
Dependencies are inferred from the claim text.