Electronic component and method for manufacturing electronic component

An electronic component comprising:

• a multilayer body that has a configuration in which a plurality of insulator layers are laminated from a lower layer side to an upper layer side;
• and
• an inductor including a plurality of inductive conductor layers that are disposed on the plurality of insulator layers and electrically connected to one another in series, the inductor being substantially helix-shaped in such a manner as to extend helically from the lower layer side to the upper layer side,
• wherein the plurality of inductive conductor layers include a first inductive conductor layer and a second inductive conductor layer adjacent to the first inductive conductor layer on the upper layer side,
• wherein each of the first inductive conductor layer and the second inductive conductor layer has a contact portion and a linear portion, the contact portion being, when viewed in the laminating direction, overlapped by an inductive conductor layer adjacent thereto on the lower layer side or the upper layer side among the plurality of inductive conductor layers, the linear portion being not overlapped by inductive conductor layers adjacent thereto on the lower layer side and the upper layer side among the plurality of inductive conductor layers, and
• wherein a lower surface of the linear portion of the second inductive conductor layer is positioned higher than a lower surface of the linear portion of the first inductive conductor layer, and is positioned lower than an upper surface of the linear portion of the first inductive conductor layer.