Copper-containing conductive pastes and electrodes made therefrom
AssigneeE. I. Du Pont de Nemours and Company
InventorsMinfang Mu, Yundan Wu
Life of this patent
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Abstract
Disclosed herein are copper-containing (Cu-containing) conductive pastes, copper (Cu) electrodes formed by firing the Cu-containing conductive paste over a substrate, and articles comprising a structural element with such Cu electrodes, wherein, the Cu-containing conductive paste contains a powder mixture of Cu, Ge, and B particles dispersed in an organic medium.
Claims13
A copper-containing (Cu-containing) conductive paste comprising:
- a) about 10-95 wt % of a powder mixture of Cu, germanium (Se), and boron (B) particles, and
- b) about 0.1-15 wt % of a glass frit, dispersed in
- c) an organic medium,
- with the total wt % of all components comprising the paste totaling to 100 wt %, and wherein, (i) the powder mixture comprises about 0.1-35 parts by weight of the Ge particles and about 0.05-15 parts by weight of the B particles, based on 100 parts by weight of the Cu particles, and provided that the combined content level of Ge and B particles is about 35 parts by weight or less;
- and (ii) the organic medium is comprised of at least one organic polymer dissolved in at least one solvent.
An article comprising a structural element, wherein the structural element is comprised of a substrate and at least one Cu electrode, wherein the at least one Cu electrode is formed by:
- (I) applying a Cu-containing conductive paste onto one side of the substrate in a predetermined shape and at a predetermined position;
- (II) drying the Cu-containing conductive paste;
- and (III) firing the Cu-containing conductive paste to form the at least one Cu electrode,
- wherein, the Cu-containing conductive paste comprises:
- a) about 10-95 wt % of a powder mixture of Cu, Ge, and B particles, and
- b) about 0.1-15 wt % of a glass fit, dispersed in
- c) an organic medium,
- with the total wt % of all components comprised in the paste totaling to 100 wt %, and wherein, (i) the powder mixture comprises about 0.01-35 parts by weight of the Ge particles and about 0.05-15 parts by weight of the B particles, based on 100 parts by weight of the Cu particles;
- and (ii) the organic medium is comprised of at least one organic polymer dissolved in at least one solvent.
Dependencies are inferred from the claim text.