Electroconductive Resin Composite and Electroconductive Resin Composition Having Excellent Impact Strength, and Method of Producing the Same
AssigneesSK Innovation Co., Ltd., SK Global Chemical Co., Ltd.
InventorYun Kyun Lee
Life of this patent
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Abstract
An electroconductive resin composite having excellent impact strength, in which an impact modifier and an electroconductive filler are dispersed in a matrix resin, is provided. The impact modifier has an average particle size of 5 μm or less and is dispersed in a domain form in a polyamide matrix resin, and the number of agglomerates of the filler in which a longest diameter of an agglomerate particle is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.
Claims19
An electroconductive resin composite, the composite comprising:
- a polyamide resin matrix;
- impact modifier domains dispersed in the matrix, the domains having an average particle size of 5 μm or less (excluding 0);
- and
- electroconductive fillers dispersed in the matrix, wherein the number of agglomerates of the fillers in which the length of a longest diameter of an agglomerate is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.
An electroconductive resin composition comprising:
- a polyamide resin;
- and
- a masterbatch including an impact modifier and electroconductive fillers,
- wherein, with respect to the fillers, interfacial energy of the impact modifier is higher than interfacial energy of the polyamide resin.
A method of producing an electroconductive resin composite, the method comprising:
- mixing a materbatch including an impact modifier and electroconductive filler with a polyamide resin to prepare a electroconductive resin composition;
- and
- melt molding the composition to prepare a composite including:
- a resin matrix including the polyamide resin;
- impact modifier domains including the impact modifier, the domains being dispersed in the matrix and having an average particle size of 5 μm or less;
- and
- conductive fillers dispersed in the matrix, wherein the number of agglomerates of the fillers in which the length of a longest diameter of an agglomerate is 10 μm or more is 50 or less, in 50 scanning electron microscope (SEM) images of an area of 0.5 mm×0.35 mm, captured at 250× magnification.
Dependencies are inferred from the claim text.