Cof structure, driving circuit and display device
AssigneeShenzhen China Star Optoelectronics Technology Co., Ltd.
InventorFeng ZHAO
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Abstract
The present invention provides a COF structure, which comprises a thin-film body, two or more driving chip, bonding wires, and bonding marks. The two or more driving chips are disposed on the same thin-film body, to generate driving signals. The bonding wires are disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips The bonding marks are disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
Claims19
A chip on film (COF) structure, comprising:
- a thin-film body;
- two or more driving chips, disposed on the same thin-film body, to generate driving signals;
- bonding wires, disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips;
- and
- bonding marks, disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
A driving circuit, used to drive a display panel, which comprises a COF structure, the COF structure comprising:
- a thin-film body;
- two or more driving chips, disposed on the same thin-film body, to generate driving signals;
- bonding wires, disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips;
- and
- bonding marks, disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
A display device, comprising a display panel and a driving circuit with a COF structure, the COF structure comprising:
- a thin-film body;
- two or more driving chips, disposed on the same thin-film body, to generate driving signals;
- bonding wires, disposed on a top side or a bottom side of the thin-film body, to form a bonding connection between external signal lines and wires of the driving chips;
- and
- bonding marks, disposed laterally on the thin-film body, to perform a location operation on the thin-film body which is used for a bonding operation.
Dependencies are inferred from the claim text.