Method of evaluating aligned patterns in directed self-assembly and using in feedback control scheme
AssigneeTokyo Electron Limited
InventorsMichael Carcasi, Mark Somervell
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AssigneeTokyo Electron Limited
InventorsMichael Carcasi, Mark Somervell
Estimating the term…
Embodiments of methods and systems for inspecting a pattern are described. The method may include providing a substrate with a pattern formed thereupon, the pattern comprising aligned features. Additionally, the method may include acquiring one of more aerial images of the pattern, each image comprising a 2-dimensional (2D) array of pixels, each pixel having an intensity. Further, the method may include transforming at least one of the one or more aerial images into spatial frequency domain to form a transform. The method may also include selecting an alignment metric defined in the spatial frequency domain, the alignment metric being correlated to a level of alignment of the pattern. Additionally, the method may include calculating the alignment metric to evaluate the level of alignment of the pattern.
A method of inspecting a pattern, comprising:
Dependencies are inferred from the claim text.