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US 2017/0286725 A1Published application
Penetration detection boundary having a heat sink
AssigneeHewlett Packard Enterprise Development LP
InventorJohn M. Lewis
Life of this patent
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Abstract
An apparatus includes a substrate and an integrated circuit that is mounted to the substrate. The substrate includes a penetration detection boundary to detect a penetration attack and a heat sink to dissipate thermal energy for the integrated circuit. The boundary includes metal layers and penetration detection traces. The ground traces are coupled together to form the heat sink.
Claims15
An apparatus comprising:
- a substrate;
- and
- an integrated circuit mounted to the substrate,
- wherein:
- the substrate comprises a penetration detection boundary to detect a penetration attack and a heat sink to dissipate thermal energy for the integrated circuit;
- the boundary comprises a plurality of metal layers associated with the substrate, and the boundary comprising ground traces and penetration detection traces;
- and
- the ground traces are coupled together to form the heat sink.
5 more elements
A method comprising:
- inhibiting a penetration attack targeting at least one integrated circuit mounted on a substrate, wherein inhibiting the penetration attack comprises providing a plurality of layers in the substrate to form a penetration detection boundary;
- providing ground traces within the penetration detection boundary;
- and
- coupling the ground traces together to form a heat sink to dissipate thermal energy produced by at least one integrated circuit mounted on the substrate.
1 more element
A system comprising:
- a processor to store at least one security key;
- and
- a substrate comprising:
- a first metal layer to communicate signals for the processor;
- and
- a plurality of additional metal layers, wherein each of the plurality of additional metal layers comprise an associated trace arranged in a tortuous pattern to detect penetration of the metal layer and an associated ground trace;
- and
- vias to electrically couple to the ground traces together to form a heat sink to dissipate power for the processor.
5 more elements
Dependencies are inferred from the claim text.