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US 2017/0285786 A1Published application
Wiring body, wiring board, touch sensor and method for producing wiring body
AssigneeFujikura Ltd.
InventorTakaharu Hondo
Life of this patent
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Abstract
A wiring body includes an adhesive :layer and a conductor pattern bonded to the adhesive layer. A surface roughness of an adhesive surface in the conductor pattern bonded to the adhesive layer is rougher than a surface roughness of another surface, which is a surface of the conductor pattern except for the adhesive surface in the conductor pattern.
Claims13
A wiring body comprising:
- an insulating member;
- and
- a conductor pattern bonded to the insulating member, wherein
- the conductor pattern includes:
- an adhesive surface bonded to the insulating member;
- and
- another surface that is a surface of the conductor pattern except for the adhesive surface, and
- a surface roughness of the adhesive surface is rougher than a surface roughness of the another surface.
5 more elements
A method for producing a wiring body, comprising:
- a first process of filling a recessed portion of intaglio with an electrically conductive material;
- a second process of forming a concave-convex shape on an upper surface of the electrically conductive material by performing at least one of drying, heating, and irradiating with an energy ray the electrically conductive material filling the intaglio;
- a third process of disposing an insulating material on the concavo-convex shape so that the insulating material is introduced into a concave of the concavoconvex shape;
- and
- a fourth process of releasing at least the insulating material and the electrically conductive material from the intaglio.
2 more elements
Dependencies are inferred from the claim text.