Determining Thermal Margins In A Multi-Die Processor

A machine-readable medium having stored thereon instructions, which if executed by at least one machine, causes the at least one machine to perform a method comprising:

• causing execution of a selected die workload for a plurality of dies of a processor;
• measuring a temperature and a power of the plurality of dies during the execution of the selected die workload;
• calculating, for each of the plurality of dies, a thermal loadline based at least in part on the measured temperature and the power;
• and
• storing the thermal loadline for each of the plurality of dies in a non-volatile storage of the processor.

A system comprising:

• a plurality of processors, at least one of the plurality of processors comprising a multi-chip package including a first die, a second die and a thermal controller to receive first thermal data from a first thermal sensor of the first die and second thermal data from a second thermal sensor of the second die, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die, calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die and determine a minimum thermal margin of the first and second thermal margins;
• a network circuit coupled to the plurality of processors;
• a cooling solution including at least one fan;
• and
• a platform controller to receive the minimum thermal margin and thermal margin information from others of the plurality of processors, and calculate a control value for the at least one fan based at least in part on the minimum thermal margin and the thermal margin information.