Piezoelectric package-integrated film bulk acoustic resonator devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• a cavity formed in the package substrate;
• and
• a piezoelectric device integrated with the package substrate, the piezoelectric device including
• a first electrode, a piezoelectric material in contact with the first electrode, and
• a second electrode in contact with the piezoelectric material, wherein the piezoelectric device is suspended with respect to the cavity of the organic substrate and the piezoelectric device generates an acoustic wave to be propagated parallel to an electric field caused by an application of an electrical signal between the first and second electrodes.

A filtering device formed in a package substrate, comprising:

• a plurality of a film bulk acoustic wave resonators formed in the package substrate with each resonator having a resonant frequency that is inversely proportional to a thickness of a film stack of each resonator which includes a piezoelectric material;
• a plurality of capacitors with each capacitor being coupled to a respective resonator;
• a plurality of inductors with each inductor being coupled to a respective capacitor;
• and
• select logic to select at least one resonator to tune a frequency of the filtering device.