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US 2017/0285493 A1Published application
Projection exposure method and projection exposure apparatus
AssigneeCarl Zeiss SMT GmbH
InventorsStephan Andre, Daniel Golde, Toralf Gruner, Johannes Ruoff
Life of this patent
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Abstract
A projection exposure method for exposing a radiation-sensitive substrate with at least one image of a pattern of a mask in a projection exposure apparatus includes using an anamorphic projection lens
Claims20
A method of using a projection exposure apparatus comprising an illumination system and an anamorphic projection lens, the method comprising:
- using the illumination system to illuminate an illumination region of a mask which comprises a pattern, the mask being located in a region of an object plane of the anamorphic projection lens;
- using the anamorphic projection lens to project an illuminated part of the pattern of the mask onto a radiation-sensitive material located in an image plane of the anamorphic projection lens;
- synchronously moving the mask and the radiation-sensitive material in a respective scanning direction during a scan operation;
- rotating the mask by a first angle about a first axis oriented perpendicular to the object plane of the anamorphic lens;
- and
- rotating the radiation-sensitive material by a second angle about a second oriented perpendicular to the image plane of the anamorphic lens,
- wherein the rotation of the mask and the rotation of the radiation-sensitive material are coordinated with one another so that:
- for a first aberration caused by the rotation of the mask, a profile over the image field is set;
- and
- for a second image aberration caused by the rotation of the mask, a profile over the image field is compensated for by the rotation of the sub radiation-sensitive material to a greater extent than the profile of the first image aberration over the image field.
7 more elements
An apparatus configured to expose a radiation-sensitive material with an image of a pattern of a mask, the apparatus comprising:
- an illumination system configured to generate an illumination radiation directed onto the mask;
- an anamorphic projection lens configured to generate an image of the pattern in the region of an image plane of the projection lens;
- a mask holding unit configured to hold the mask between the illumination system and the projection lens so that the pattern is arranged in a region of an object plane of the anamorphic projection lens and so that the pattern is movable in a scanning direction perpendicular to a reference axis of the anamorphic projection lens;
- a substrate holding unit configured to hold the radiation-sensitive material so that the radiation-sensitive material is in a region of the image plane of the anamorphic projection lens, and so that the radiation-sensitive material is synchronously movable with the mask perpendicular to the reference axis of the projection lens;
- and
- a control unit,
- wherein:
- the image plane is optically conjugate to the object plane;
- the mask holding unit comprises a first rotation unit configured to controllably rotate the mask about a first rotation axis running orthogonally with respect to the object plane;
- the substrate holding unit comprises a second rotation unit configured to controllably rotate the radiation-sensitive material about a second rotation axis running orthogonally with respect to the image plane;
- the control unit is configured to rotate the mask holding unit and the substrate holding unit in a manner coordinated with each other so that:
- for a first image aberration caused by the rotation of the mask, a profile over the image field is set;
- and
- for a second image aberration caused by the rotation of the mask, a profile over the image field is compensated for by the rotation of the radiation-sensitive material to a greater extent than the profile of the first image aberration over the image field;
- and
- the apparatus is a projection exposure apparatus.
13 more elements
An apparatus, comprising:
- an illumination system configured provide an illumination radiation directed onto at least a portion of a pattern of a mask;
- an anamorphic projection lens configured to generate an image of at least a portion of the illuminated portion of the pattern of the mask, in the region of an image plane of the projection lens;
- and
- a control unit,
- wherein:
- the mask is located in a region of an object plane of the anamorphic projection lens;
- the radiation-sensitive material is located in a region of an image plane of the anamorphic lens;
- the image plane is optically conjugate to the object plane;
- the control unit is configured to rotate the mask and the radiation-sensitive material so that:
- the rotation of the mask causes first and second image aberrations over the image field;
- a profile of the first aberration over the image field is set;
- and
- a profile of the second aberration over the image field is compensated for by the rotation of the radiation-sensitive material to a greater extent than the profile of the first image aberration over the image field;
- and
- the apparatus is a projection exposure apparatus.
12 more elements
Dependencies are inferred from the claim text.