Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device

A photosensitive resin composition comprising a polysiloxane (A), wherein

• the polysiloxane (A) is a polysiloxane obtained by hydrolyzing an organosilane, followed by condensation, and the organosilane includes an organosilane represented by the general formula (21) and an organosilane represented by the general formula (22):
• wherein R53 and R54, in the general formula (21), each independently represents hydrogen, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group, and R55 and R56 each independently represents hydrogen, an alkyl group, an acyl group, or an aryl group;
• wherein R57 to R60, in the general formula (22), each independently represents hydrogen, an alkyl group, an acyl group, or an aryl group, and q represents an integer of 1 to 10;
• and
• wherein the content ratio of an organosilane unit represented by the general formula (2) in the polysiloxane (A) is (X) mol % in terms of a molar ratio of Si atoms, and the content ratio of an organosilane unit represented by the general formula (3) is (Y) mol % in terms of a molar ratio of Si atoms:
• wherein R1 and R2, in the general formula (2), each independently represents hydrogen, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group;
• wherein R7 and R8, in the general formula (3), each independently represents hydrogen, an alkyl group, an acyl group, an aryl group, a polymer chain of the polysiloxane, or a substituent represented by the general formula (7);
• wherein R4 to R6, in the general formula (7), each independently represents hydrogen, an alkyl group, a cycloalkyl group, an alkenyl group, or an aryl group;
• and
• wherein
• (X) and (Y) are represented by the general formulas (4) to (6):
• 7.5≦(X)≦75 (4)
• 2.5≦(Y)≦40 (5)
• 1.5×(Y)≦(X)≦3×(Y) (6)