US 2017/0285474 A1 · PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, RESIN PATTERN PRODUCTION METHOD, CURED FILM, AND DISPLAY DEVICE

Abstract

The present invention provides a photosensitive resin laminate in which (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, and (C) a photosensitive resin layer including a photopolymerization initiator are laminated on a support film. The photosensitive resin laminate is used in forming the protective film of a conductor part, the thickness of the photosensitive resin is 20 μm or less, and the cured product of the photosensitive resin layer satisfies conditions (1) to (3): (1) the crosslink density is 1,000 mol/m3-8,000 mol/m3; (2) the peak top value of Tan δ is 0.4 or greater; and (3) the refractive index at a wavelength of 532 nm is 1.50-1.60.

Claims15

Dependent claims

A photosensitive resin laminate comprising a support film, and a photosensitive resin layer including:

(A) an alkali-soluble polymer;
(B) a compound having an ethylenic unsaturated double bond;
and
(C) a photopolymerization initiator;
wherein the photosensitive resin layer is laminated on the support film,
the photosensitive resin laminate is to be used to form a protective film for a conductor component,
the thickness of the photosensitive resin layer is less than or equal to 20 μm, and
a cured product of the photosensitive resin layer satisfies the following conditions (1) to (3):
(1) a crosslink density of 1,000 mol/m3 to 8,000 mol/m3;
(2) a Tan δ peak top value of 0.4 or greater;
and
(3) a refractive index of 1.50 to 1.60 at a wavelength of 532 nm.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/510,619Filed 24 Sep 2015

Priority

JP 2014-19405924 Sep 2014

Published

5 Oct 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification12 codes

G03F 7/033
With binders: the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
G03F 7/027
Photosensitive materials: non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
G03F 7/031
With photosensitivity-increasing substances, e.g. photoinitiators: organic compounds not covered by group G03F7/029
G03F 7/038
Photosensitive materials: macromolecular compounds which are rendered insoluble or differentially wettable

Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device

Life of this patent

Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device

Life of this patent

Abstract

Claims15