Back to results
US 2017/0285351 A9Published application
Laser via drilling apparatus and methods
OwnerIslam A. Salama, Nathaniel R. Quick +1inventors
InventorsIslam A. Salama, Nathaniel R. Quick, Aravinda Kar
Life of this patent
Estimating the term…
Abstract
A method includes generating a laser beam and applying the beam to a substrate to form a via in the substrate. The laser beam has an intensity profile taken at a cross-section transverse to the direction of propagation of the beam. The intensity profile has a first substantially uniform level across an interior region of the cross-section and a second substantially uniform level across an exterior region of the cross-section. The second intensity level is greater than the first intensity level.
Claims11
An apparatus comprising:
- a beam source to generate a laser beam;
- and
- a beam shaping optical element positioned to receive the laser beam and to modify an intensity profile of the laser beam, the beam shaping optical element including a material selected from the group consisting of GaP, SiC and GaN,
- wherein the beam source includes a laser device for generating the laser beam, the laser device separate from the beam shaping optical element.
1 more element
A method comprising:
- providing an optical element that includes a material selected from the group consisting of GaP, SiC and GaN;
- generating a laser beam with a laser device that is separate from the optical element;
- and
- passing the laser beam through the optical element to modify an intensity profile of the laser beam.
1 more element
Dependencies are inferred from the claim text.