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US 2017/0285294 A1Published application
Titanium Copper Foil Having Plated Layer
AssigneeJX Nippon Mining & Metals Corporation
InventorKenta Tsujie
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AssigneeJX Nippon Mining & Metals Corporation
InventorKenta Tsujie
Estimating the term…
The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and a Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to the definition in the specification.
A titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5% by mass to 5.0% by mass, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of from 0% by mass to 1.0% by mass, the balance being copper and inevitable impurities, and the base metal having a thickness of from 0.018 mm to 0.1 mm, wherein the titanium copper foil has a plated layer in which an underlying Cu plated layer and an Sn plated layer have been laminated in this order on a surface of the base metal, and has an adhesive strength of 1 N or more as measured by a solder adhesive strength test according to a definition in the specification.
A method for producing a titanium copper foil, comprising:
Dependencies are inferred from the claim text.