Electronic module

An electronic module comprising:

• an electronic device comprising
• an insulating substrate comprising a first principal surface on which a light emitting-receiving device is mounted and a side surface perpendicular to the first principal surface,
• a joining body comprising an end surface at which an end portion of an optical transmission path extending through the joining body is disposed and a side surface perpendicular to the end surface, the end surface facing the first principal surface of the insulating substrate and being joined to the first principal surface in a state in which the end portion of the optical transmission path is positioned with respect to the light emitting-receiving device, the side surface being continuous with the side surface of the insulating substrate and defining a single side surface together with the side surface of the insulating substrate, and
• a mounting electrode disposed on an inner surface of a groove in the single side surface and extending in a thickness direction perpendicular to the first principal surface of the insulating substrate;
• a circuit board comprising
• a board body comprising an outer principal surface, and
• a connecting circuit portion disposed on the outer principal surface of the board body;
• and
• a joining material that connects the mounting electrode to the connecting circuit portion and mounts the electronic device on the circuit board in a state in which the single side surface of the electronic device faces the outer principal surface of the circuit board,
• wherein an end portion of the mounting electrode near the joining body is located further toward the insulating substrate than an end portion of the groove near the joining body, and a fillet of the joining material is disposed in a region of the groove near the joining body.