Integrated circuit packages including an optical redistribution layer

A packaged component, comprising:

• a substrate having a patterned surface with one or more electrical contact areas and one or more optical contact areas;
• one or more electrical redistribution layer (eRDL) features;
• one or more optically-transmissive optical redistribution layer (oRDL) features;
• a build-up layer extending over the patterned surface of the substrate, around portions of the eRDL features, and around portions of the oRDL features;
• and
• one or more regions between the patterned surface of the substrate and an outer surface of the build-up layer in which the eRDL features and the oRDL features overlap in a direction extending outward from the patterned surface,
• wherein the outer surface of the build-up layer has one or more first apertures and one or more second apertures;
• wherein the eRDL features extend from the electrical contact areas to the first apertures;
• wherein the oRDL features extend from the optical contact areas to the second apertures;
• and
• wherein the oRDL features comprise an optically transmissive material.

A method of fabricating a packaged component, the method comprising:

• receiving a substrate having a patterned surface with one or more optical contact areas;
• depositing a build-up layer over the substrate;
• patterning the build-up layer to at least partially expose the optical contact areas;
• depositing an optical redistribution layer (oRDL) above the build-up layer and the exposed optical contact areas;
• and
• polishing the oRDL to expose the build-up layer, wherein the polished oRDL is planar with the exposed build-up layer.

A packaged component, comprising:

• a substrate having a patterned surface with one or more electrical contact areas and one or more optical contact areas;
• one or more electrical redistribution layer (eRDL) features;
• one or more optically-transmissive optical redistribution layer (oRDL) features;
• and
• a build-up layer extending over the patterned surface of the substrate, around portions of the eRDL features, and around portions of the oRDL features,
• wherein the build-up layer has an outer surface with one or more first apertures and one or more second apertures;
• wherein the eRDL features extend from the electrical contact areas to the first apertures;
• wherein the oRDL features extend from the optical contact areas to the second apertures;
• wherein first portions of the oRDL features extend lengthwise over the patterned surface;
• wherein second portions of the oRDL features extend lengthwise outward from the patterned surface;
• and
• wherein the oRDL features comprise an optically transmissive material.