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US 2017/0285096 A1Published application
Printed wiring board, crack prediction device, and crack prediction method
AssigneeFujitsu Limited
InventorsShigeo IRIGUCHI, Naoki NAKAMURA, Shigeru SUGINO, Takahide MUKOYAMA, Ryo KANAI, Nobuo TAKETOMI, Kiyoyuki HATANAKA
Life of this patent
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Abstract
A printed wiring board includes: a laminated body that has a plurality of wiring layers laminated therein; a first through hole that electrically connects two or more wiring layers with each other; and a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole.
Claims2
A printed wiring board comprising:
- a laminated body that has a plurality of wiring layers laminated therein;
- a first through hole that electrically connects two or more wiring layers with each other;
- and
- a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole,
- wherein the second through hole has a pinhole in an electrically conductive material formed on an inner wall.
2 more elements
A printed wiring board comprising:
- a laminated body that has a plurality of wiring layers laminated therein;
- a first through hole that electrically connects two or more wiring layers with each other;
- and
- a second through hole that has strength to expansion and contraction of the laminated body less than in the first through hole,
- wherein the second through hole has a material having a coefficient of thermal expansion greater than an electrically conductive material formed on an inner wall filled in the through hole.
2 more elements
Dependencies are inferred from the claim text.