Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges

A method of testing a plurality of devices under test (DUTs), which is present on a substrate, with a probe head assembly, which includes a plurality of probe heads, wherein each of the plurality of DUTs includes a contact pad, wherein each of the plurality of probe heads includes a probe tip configured to communicate with a corresponding contact pad of a corresponding DUT of the plurality of DUTs, wherein the plurality of DUTs is arranged on the substrate in a DUT array that defines an average DUT array spacing, wherein the plurality of probe heads is arranged within the probe head assembly in a probe head array that defines an average probe head array spacing, and further wherein the average probe head array spacing is matched to the average DUT array spacing at a design temperature, the method comprising:

• equilibrating the substrate and the probe head assembly to a test temperature that is different from the design temperature, wherein, at the test temperature, the average probe head array spacing differs from the average DUT array spacing;
• operatively aligning each probe tip of a first subset of the plurality of probe heads with the corresponding contact pad of a first subset of the plurality of DUTs, wherein the operatively aligning includes operatively aligning such that at least one probe tip of at least one probe head of the plurality of probe heads is misaligned with the corresponding contact pad of the corresponding DUT of the plurality of DUTs;
• bringing each probe tip of the first subset of the plurality of probe heads into communication with the corresponding contact pad of the first subset of the plurality of DUTs;
• testing the operation of the first subset of the plurality of DUTs;
• and
• repeating the operatively aligning, the bringing, and the testing to:
• (i) align each probe tip of a second subset of the plurality of probe heads, which is different from the first subset of the plurality of probe heads, with the corresponding contact pad of a second subset of the plurality of DUTs, which is different from the first subset of the plurality of DUTs;
• (ii) bring each probe tip of the second subset of the plurality of probe heads into communication with the corresponding contact pad of the second subset of the plurality of DUTs;
• and
• (iii) test the operation of the second subset of the plurality of DUTs.