System and Method for a Transducer in an eWLB Package
AssigneeInfineon Technologies AG
InventorsStephan Pindl, Daniel Lugauer, Dominic Maier, Alfons Dehe
Life of this patent
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Abstract
According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
Claims35
A sensor package comprising:
- an electrically insulating substrate comprising a cavity in the electrically insulating substrate;
- an ambient sensor supported by the electrically insulating substrate and arranged adjacent the cavity;
- an integrated circuit die embedded in the electrically insulating substrate;
- and
- a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die.
A method of forming a sensor package, the method comprising:
- arranging a dummy patterning structure on a carrier substrate;
- arranging an integrated circuit die on the carrier substrate;
- embedding the dummy patterning structure and the integrated circuit die in an electrically insulating material;
- removing the carrier substrate;
- forming an ambient sensor adjacent a first surface of the dummy patterning structure;
- exposing a second surface of the dummy patterning structure by thinning the electrically insulating material, the second surface opposite the first surface;
- and
- forming a cavity in the electrically insulating material by etching the dummy patterning structure.
A method of forming a sensor package, the method comprising:
- forming an ambient sensor on a first surface of a dummy patterning structure;
- arranging the dummy patterning structure on a carrier substrate;
- arranging an integrated circuit die on the carrier substrate;
- embedding the dummy patterning structure and the integrated circuit die in electrically insulating material;
- removing the carrier substrate;
- exposing a second surface of the dummy patterning structure by thinning the electrically insulating material, the second surface opposite the first surface;
- and
- forming a cavity in the electrically insulating material by etching the dummy patterning structure.
Dependencies are inferred from the claim text.