Process for manufacturing a mems pressure sensor, and corresponding mems pressure sensor

A MEMS pressure sensor comprising:

• a body including semiconductor material and having a top surface;
• a buried cavity contained within the body and separated from the top surface by a membrane, wherein the membrane is suspended above the buried cavity;
• a fluidic-communication access channel configured to provide fluidic communication between the membrane and an external environment;
• a plate region made of conductive material, the plate region suspended above the membrane and separated from the membrane by an empty space;
• and
• first and second electrical-contact elements configured to provide electrical connection to the membrane and the plate region, respectively, wherein the membrane and the plate region form a sensing capacitor.

An electronic device comprising:

• an ASIC;
• and
• a MEMS pressure sensor coupled to the ASIC, the MEMS pressure sensor including:
• a body including semiconductor material;
• a buried cavity contained within the body;
• a membrane suspended over the buried cavity;
• a fluid access channel fluidically coupling the membrane with an external environment;
• a plate region suspended above the membrane and separated by the membrane by an empty space, the plate region being made of conductive material;
• a first electrical-contact element coupled to the membrane;
• and
• a second electrical-contact element coupled to the plate region, wherein the membrane and the plate region form a sensing capacitor.