Multi-Die Pressure Sensor Package

A method of manufacturing a pressure sensor package, the method comprising:

• attaching a first side of a pressure sensor to a substrate which has an opening, the pressure sensor having a second side opposite the first side, the first side having a pressure inlet aligned with the opening in the substrate, the second side having one or more electrical contacts;
• attaching a logic die to an opposite side of the substrate as the pressure sensor, the logic die operable to process signals from the pressure sensor;
• connecting first electrical conductors to the one or more electrical contacts of the pressure sensor;
• connecting second electrical conductors to one or more electrical contacts of the logic die;
• completely encapsulating the second electrical conductors and at least partly encapsulating the logic die and the first electrical conductors in a mold compound;
• and
• forming an open passage in the mold compound which is aligned with the opening in the substrate so as to define a pressure port of the pressure sensor package.