Microelectronic Package with Illuminated Backside Exterior

A method comprising:

• attaching a die to a package substrate;
• attaching a lamp to the package substrate;
• applying a molding compound over the die and the package substrate;
• forming a screen over the die, the screen being optically coupled to the lamp so that when the lamp is illuminated, the illumination is visible through the screen;
• and
• polishing the molding compound and the screen.

A system comprising:

• an external housing, the housing having a window;
• a system board within the housing;
• and
• a package attached to the system board, the package having an illumined backside positioned so that the illumination is visible through the window, the package having a package substrate, a die attached to the package substrate, a cover over the die and the package substrate, a lamp to generate the illumination, and a screen over the die, externally visible and optically coupled to the lamp so that when the lamp is illuminated the illumination is externally visible through the screen.