Using white leds to enhance intensity of colored light from colored leds

A method for projecting light within and limited to a non-white target color region, the method comprising:

• emitting colored light within the target color region from at least one base color light emitting diode (LED);
• emitting white light within a white color region from at least one additive LED, the white light having a correlated color temperature (CCT) skewed toward the target color region;
• and
• directing the colored light and the white light through a filter toward a notional viewer to produce filtered light;
• wherein the filter suppresses any portions of the colored light and the white light that are outside of the target color region so that a dominant portion of the filtered light reaching the notional viewer is within the target color region.

A method for forming a printed circuit board having a heat sink, the method comprising:

• screening a solder layer onto an etched solder mask layer on an insulating substrate layer, wherein the etched solder mask layer is adhered over a trace layer on the insulating substrate layer, so that the solder layer adheres to solder pads on the trace layer, the solder pads being portions of the trace layer that are exposed by openings in the etched solder mask layer, and so that the solder layer forms a plurality of discrete individual solder portions spaced apart and separate from one another;
• positioning leads of at least one electronic component on a first set of the solder portions;
• leaving a second set of the solder portions free of any electronic component leads;
• moving the insulating substrate layer, with the trace layer, the etched solder mask, the solder layer and the at least one electronic component thereon, into a reflow oven to melt the solder layer whereby the solder forming the first set of the solder portions flows between the respective leads and the respective solder pads;
• and
• removing the insulating substrate layer, with the trace layer, the etched solder mask, the solder layer and the at least one electronic component thereon, from the reflow oven to cool and solidify the solder layer whereby solder forming the first set of the solder portions physically and electrically couples the leads to the respective solder pads and solder forming the second set of the solder portions is at least physically and thermally coupled to the respective solder pads.

A printed circuit board, comprising:

• an insulating substrate layer;
• a trace layer disposed on the insulating substrate layer, the trace layer comprising a plurality of conductive traces and a plurality of solder pads coupled to the conductive traces;
• a solder mask layer disposed on the trace layer so that traces in the trace layer are disposed between the substrate layer and the solder mask layer, the solder mask layer having a plurality of openings therein in registration with the solder pads whereby the solder pads are exposed by the solder mask layer;
• and
• a plurality of solder portions bonded to the solder pads, wherein a first set of the solder portions physically and electrically couples leads of at least one electronic component to respective ones of the solder pads, and wherein a second set of the solder portions is free of any electronic component leads.