Electroplating wafers having a notch

An electroplating method, comprising:

• placing a wafer having a pattern-induced non-uniformity into a bath of electrolyte held in a vessel;
• placing at least one first contact finger onto the wafer at the pattern-induced non-uniformity;
• placing a plurality of second contact fingers around an entire perimeter of the wafer, except at the pattern-induced non-uniformity, with the second contact fingers insulated from the at least one first contact finger;
• sealing the at least one first contact finger and the second contact fingers from the electrolyte;
• introducing electrical current into the electrolyte from at least one electrode in the vessel;
• and
• applying voltage of a first polarity to the at least one first contact finger while simultaneously applying a voltage of a second polarity to the second contact fingers.

Electroplating apparatus, comprising:

• a vessel for holding electrolyte;
• at least one first electrode in the vessel;
• a field shaping unit in the vessel;
• a head including a contact ring for holding a wafer having a pattern-induced non-uniformity;
• at least one second electrode in the vessel above the at least one first electrode;
• the contact ring including a perimeter voltage ring having a plurality of perimeter contact fingers for contacting the wafer around the perimeter of the wafer, and a pattern-induced non-uniformity contact segment having one or more pattern-induced non-uniformity contact fingers for contacting the wafer at the pattern-induced non-uniformity, and with the perimeter voltage ring insulated from the pattern-induced non-uniformity contact segment;
• the perimeter voltage ring electrically connected only to a first voltage source;
• and
• the pattern-induced non-uniformity contact segment electrically connected to only a second voltage source.