Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features

A method comprising:

• a) providing a substrate comprising a layer of photoresist, wherein the layer of photoresist comprises a plurality of apertures;
• b) providing a copper electroplating bath comprising one or more sources of copper ions, one or more electrolytes;
• one or more accelerators;
• one or more suppressors;
• one or more first reaction products of a bisepoxide and an aromatic amino acid compound having a formula:
• wherein R1 and R2 are independently chosen from hydrogen, —NH2 and —OH;
• E is nitrogen or CR3;
• G is nitrogen or CR4 and Z is nitrogen or CR5 with the proviso that only one of E, G and Z is a nitrogen at the same time and R3, R4 and R5 are independently chosen from hydrogen, —NH2 and —OH with the proviso that at least one of R1, R2, R3, R4 and R5 is —NH2;
• and one or more second reaction products of an imidazole with an epoxide;
• c) immersing the substrate comprising the layer of photoresist with the plurality of apertures in the copper electroplating bath;
• and
• d) electroplating a plurality of copper photoresist defined megafeatures in the plurality of apertures, the plurality of photoresist defined megafeatures comprise an average % TIR of −5% to +15%.