Additive for high-purity copper electrolytic refining and method of producing high-purity copper
AssigneeMitsubishi Materials Corporation
InventorsKenji Kubota, Yoshie Tarutani, Kiyotaka Nakaya
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Abstract
The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
Claims20
An additive for high-purity copper electrolytic refining which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
A method of producing high-purity copper comprising:
- performing copper electrolysis using a copper electrolyte to which an additive is added which is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group.
Dependencies are inferred from the claim text.