Additive for high-purity copper electrolytic refining and method of producing high-purity copper

Abstract

The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene group, in which a dispersion term dD of the Hansen solubility parameters satisfies 10≦dD≦20, a polarity term dP of the Hansen solubility parameters satisfies 6≦dP≦9, and a hydrogen bonding term dH of the Hansen solubility parameters satisfies 9≦dH≦11.

Dependencies are inferred from the claim text.