Copper alloy sheet material and method for producing copper alloy sheet material
AssigneeJX Nippon Mining & Metals Corporation
InventorKEI SAEGUSA
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AssigneeJX Nippon Mining & Metals Corporation
InventorKEI SAEGUSA
Estimating the term…
A copper alloy sheet material which contains 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1. 2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities. The material fulfills the relationships 1.0≦I {200}/I0 {200}≦5.0 and 5.0 μm≦GS≦60.0 μm, and these have the relationship (Equation 1): 5.0≦{(I {200}/I0 {200})/GS}×100≦21.0, in which the I {200} represents an X-ray diffraction intensity of a {200} crystal plane, the I0 {200} represents an X-ray diffraction intensity of a {200} crystal plane of standard pure copper powder, and the GS (μm) represents an average crystal grain size. An electrical conductivity is 43.5% to 55.0% IACS and 0.2% yield strength is 720 to 900 MPa.
A copper alloy sheet material comprising 0.5 to 2.5% by mass of Ni, 0.5 to 2.5% by mass of Co, 0.30 to 1. 2% by mass of Si and 0.0 to 0.5% by mass of Cr, the balance being Cu and unavoidable impurities, wherein the copper alloy sheet material fulfills the relationships 1.0≦I {200}/I0 {200}≦5.0 and 5.0 μm≦GS≦60.0 μm, and these have the relationship (Equation 1):
A method for producing a copper alloy sheet material, comprising the successive steps of:
Dependencies are inferred from the claim text.