Thermosetting resin composition

A resin composition including (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and satisfying the following conditions:

• (I-I) the minimum modulus is no greater than 104 MPa by evaluation with a rheometer, when evaluated at a set temperature of 200° C. after temperature increase from 23° C. to 200° C. at 50° C./min;
• (I-II) the softening point of the epoxy resin (A) is 35° C. or higher;
• (I-III) the residual solvent in the resin composition is less than 0.1 wt %;
• and
• (I-IV) the softening point of the curing agent (B) is 105° C. or higher.

A resin composition including (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler, and satisfying the following conditions:

• (II-I) X atoms other than C, O, H and N atoms in the main component of the inorganic filler (C) (the component present in a range of 1 to 95 mol %), based on EDX measurement, are on the surface of the inorganic filler (C) in the resin composition;
• (II-II) the weight percentage of the inorganic filler (C) in the resin composition is no greater than 95 wt %;
• (II-III) the mean particle size of the inorganic filler (C) is 0.5 μm or greater;
• (II-IV) a ratio of the specific surface area of the inorganic filler (C) for the total resin composition is no greater than 3 m2/g;
• (II-V) the softening point of the epoxy resin (A) is 35° C. or higher;
• (II-VI) the residual solvent in the resin composition is less than 0.1 wt %;
• and
• (II-VII) the softening point of the curing agent (B) is 105° C. or higher.