1K High Temperature Debondable Adhesive

Abstract

The present disclosure provides 1k high temperature debondable adhesives for use in the temporary attachment of one substrate to another substrate. The adhesives composition comprising(a) 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane, or the hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, or a mixture of a hydrosilation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups and a hydrosilation reaction product of the reaction between the vinyl groups on vinyl polysiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H groups, and (b) mercapto-crosslinker. The adhesive composition is cured by UVNis/LED or thermal or combined and is cured faster requiring lower energy. The present disclosure also provides assemblies including such an adhesive and methods of using the adhesives.

Dependencies are inferred from the claim text.