Conductive adhesive with spherical graphene and manufacturing method thereof

Abstract

A conductive adhesive includes spherical graphene and an epoxy gel system that includes epoxy, a hardener, and an accelerant. A mass ratio of the epoxy gel system to the spherical graphene is 100:2-30. The epoxy of the epoxy gel system is one of one of bisphenol A epoxy resins E44, bisphenol A epoxy resins E51, bisphenol A epoxy resins E54, bisphenol A epoxy resins EPON826, and bisphenol A epoxy resins EPON828, and an amount of the epoxy to the epoxy gel system is 80 wt % to 95 wt %. The hardener is one of hexahydrophthalic anhydride, tetrahydrophthalic anhydride, succinic dihydrazide, adipic acid dihydrazide, dicyandiamide, and phenylenediamine, and an amount of the hardener to the epoxy gel system is 1 wt % to 12 wt %. The accelerant is one of 2-ethyl-4-methylimidazole, imidazole, 2-methylimidazole, and triethylamine, and an amount of the accelerant to the epoxy system is 0.3 wt % to 5 wt %.

Dependencies are inferred from the claim text.