Metal powder sintering paste and method of producing the same, and method of producing conductive material
AssigneeNichia Corporation
InventorsTeppei KUNIMUNE, Masafumi KURAMOTO
Life of this patent
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Abstract
There is a problem that when a silver powder sintering paste that is substantially free from resin is used, an organic solvent used as a dispersion medium bleeds, which results in contamination and wire bonding defects. In order to solve the problem, provided is a metal powder sintering paste that contains, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm and further contains an anionic surfactant but is substantially free from resin.
Claims16
A metal powder sintering paste,
- the paste comprising, as a principal component, silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm, and
- further comprising an anionic surfactant, and
- being substantially free from resin.
A method of producing a metal powder sintering paste, comprising mixing an anionic surfactant and silver particles having an average particle diameter (a median diameter) of 0.3 μm to 5 μm together but substantially not with resin.
Dependencies are inferred from the claim text.