Piezoelectric package-integrated switching devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate;
• a cavity formed in the package substrate;
• and
• a piezoelectric switching device integrated within the package substrate, the piezoelectric switching device having a piezoelectric material that is coupled to first and second electrodes and a movable structure that is mechanically coupled to one of the electrodes, the movable structure having a released end positioned within the cavity and being capable of switching from a first position to a second position based on actuation of the piezoelectric switching device.