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US 2017/0283247 A1Published application
Semiconductor device including a mems die
AssigneeInfineon Technologies AG
InventorsThorsten Meyer, Dominic Maier, Johannes Lodermeyer, Bernd Stadler
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a microelectromechanical system (MEMS) die, a lid, and an integrated circuit die. The lid is over the MEMS die and defines a cavity between the lid and the MEMS die. The integrated circuit die is attached to an inner side of the lid. The integrated circuit die is electrically coupled to the MEMS die.
Claims22
A semiconductor device comprising:
- a microelectromechanical system (MEMS) die;
- a lid that includes an inner surface and a bottom surface, wherein the inner surface of the lid is over the MEMS die and defines a cavity between the inner surfaced and the MEMS die, wherein a metallization layer is attached to the inner surface and the bottom surface of the lid;
- and
- an integrated circuit die attached to the metallization layer at the inner surface of the lid, the integrated circuit die electrically coupled to the MEMS die through the metallization layer at the inner surface and the bottom surface of the lid.
1 more element
(canceled)
A semiconductor device comprising:
- a microelectromechanical system (MEMS) die;
- an encapsulation material laterally surrounding the MEMS die;
- a via element extending through the encapsulation material;
- a redistribution layer electrically coupling the MEMS die to the via element;
- and
- a lid assembly comprising a lid having an inner surface and a bottom surface, a metallization layer that is attached to the inner surface and the bottom surface of the lid, and an application specific integrated circuit (ASIC) die that is attached to the metallization layer at the inner surface of the lid, wherein the inner surface of the lid is over the ASIC die, and wherein the ASIC die is electrically coupled to the MEMS die through the metallization layer at the inner surface and the bottom surface of the lid, the via element and the redistribution layer.
3 more elements
A method for fabricating a semiconductor device, the method comprising:
- encapsulating a microelectromechanical system (MEMS) die and via elements with an encapsulation material;
- removing a portion of the encapsulation material to expose the MEMS die and the via elements;
- forming a redistribution layer to electrically couple the MEMS die to the via elements;
- and
- attaching a lid assembly over the MEMS die, wherein the lid assembly comprises a lid having an inner surface and a bottom surface, a metallization layer that is attached to the inner surface and the bottom surface of the lid, and an integrated circuit die that is attached to the metallization layer at the inner surface of the lid, wherein the lid assembly is attached over the MEMS die such that the inner surface of the lid is over the MEMS die and the metallization layer at the inner surface and the bottom surface of the lid electrically couples the integrated circuit die to the MEMS die through the via elements and the redistribution layer.
2 more elements
A semiconductor device comprising:
- a microelectromechanical system (MEMS) die;
- a lid over the MEMS die defining a cavity between an inner surface of the lid and the MEMS die;
- a passive component attached to the inner surface of the lid;
- an integrated circuit die attached to the inner surface of the lid;
- an encapsulation material laterally surrounding the MEMS die;
- a redistribution layer on the encapsulation material and the MEMS die;
- a via element extending through the encapsulation material;
- and
- a metallization layer attached to the inner surface and a bottom surface of the lid, wherein the metallization layer at the inner surface is electrically coupled to the integrated circuit die and the passive component, wherein the metallization layer at the inner surface and the bottom surface of the lid electrically couples the integrated circuit die to the MEMS die through the via element and the redistribution layer,
- wherein the integrated circuit die is embedded within the inner side of the lid, and wherein the MEMS die comprises a microphone.
7 more elements
22-26. (canceled)
Dependencies are inferred from the claim text.