Vacuum laminating apparatus and method for manufacturing semiconductor apparatus

A method for manufacturing a semiconductor apparatus, comprising:

• a preparation step of preparing a support-base attached encapsulant including a thermosetting resin layer stacked as an encapsulant on a support base;
• a coating step of coating a semiconductor-device mounting surface of a substrate on which semiconductor devices are mounted, or a semiconductor-device forming surface of a wafer on which semiconductor devices are formed with the thermosetting resin layer of the support-base attached encapsulant;
• an encapsulating step of heating and curing the thermosetting resin layer to collectively encapsulate the semiconductor-device mounting surface of the substrate or the semiconductor-device forming surface of the wafer;
• a cutting step of cutting the encapsulated substrate or wafer by dicing;
• wherein
• the coating step includes surrounding at least a side face of the support-base attached encapsulant by a frame mechanism, holding the substrate or the wafer with the substrate or the wafer facing and spaced apart from the thermosetting resin layer of the support-base attached encapsulant, and vacuum laminating the support-base attached encapsulant surrounded by the frame mechanism together with the substrate or the wafer.