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US 2017/0282502 A1Published application
Substrate assembly, method of forming the same, and electronic device including the same
AssigneesSamsung Electronics Co., Ltd., Sungkyunkwan University Foundation for Corporate Collaboration
InventorsHyeon-jin SHIN, Sang-Woo KIM, Jin yeong LEE
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Abstract
A substrate assembly includes a first hexagonal boron nitride sheet directly bonded to a surface of a substrate, and a metal layer on the first hexagonal boron nitride sheet.
Claims11
A method of forming a substrate assembly, the method comprising:
- preparing a substrate in a chamber;
- combining a solid-state nitrogen source and a boron source on the substrate;
- forming a metal layer on a surface of the substrate including the combined solid-state nitrogen and boron sources;
- and
- forming a first hexagonal boron nitride sheet directly bonded to the surface of the substrate by performing a heat treatment on the substrate including the metal layer and the combined solid-state nitrogen and boron sources.
2 more elements
A method of forming a substrate assembly, the method comprising:
- preparing a substrate in a chamber;
- forming a metal layer on the substrate;
- and
- forming a first hexagonal boron nitride sheet between the substrate and the metal layer, the first hexagonal boron nitride sheet being directly bonded to a surface of the substrate, the forming a first hexagonal boron nitride sheet including,
- applying at least one of a nitrogen source and a boron source in one of a gas and solid state to the substrate from outside the metal layer, and
- performing a heat treatment on the substrate.
3 more elements
Dependencies are inferred from the claim text.