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US 2017/0282305 A1Published application
Solder alloy and package structure using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKIYOHIRO HINE, AKIO FURUSAWA, HIDETOSHI KITAURA
Life of this patent
Estimating the term…
Abstract
A solder alloy contains 0.5 mass % or more and 1.25 mass % or less of Sb, In which satisfies 5.5≦[In]≦5.50+1.06[Sb] in a case of 0.5≦[Sb]≦1.0; and 5.5≦[In]≦6.35+0.212[Sb] in a case of 1.0<[Sb]≦1.25 (in the expression, [Sb] indicates the Sb content percentage (mass %) and [In] indicates the In content percentage (mass %)), 0.5 mass % or more and 1.2 mass % or less of Cu, 0.1 mass % or more and 3.0 mass % or less of Bi, and 1.0 mass % or more and 4.0 mass % or less of Ag. The remainder is formed from Sn.
Claims5
A solder alloy containing;
- 0.5 mass % or more and 1.25 mass % or less of Sb, In satisfying the following expression (I) or (II):
- in a case of 0.5≦[Sb]≦1.0,
- 5.5≦[In]≦5.50+1.06[Sb] (I)
- in a case of 1.0<[Sb]≦1.25,
- 5.5≦[In]≦6.35+0.212[Sb] (II)
- (in the expression, [Sb] indicates a Sb content percentage (mass %) and [In] indicates an In content percentage (mass %)),
- 0.5 mass % or more and 1.2 mass % or less of Cu,
- 0.1 mass % or more and 3.0 mass % or less of Bi,
- 1.0 mass % or more and 4.0 mass % or less of Ag, and
- has a remainder formed from Sn.
7 more elements
Dependencies are inferred from the claim text.