US 2017/0257977 A1 · THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS

Abstract

An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

Claims20

Dependent claims

A method comprising:

introducing into a mold cavity an electronic component to be encapsulated, said mold cavity comprising at least first and second halves, at least one of said halves being formed with a negative of a thermal-interface-material engaging pattern thereon;
introducing into said mold cavity an encapsulating material which encapsulates said electronic component and engages said negative of said thermal-interface-material engaging pattern;
and
allowing said encapsulating material to solidify such that a thermal-interface-material engaging surface of said encapsulant solidifies with said thermal-interface-material engaging pattern thereon.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

15/060,137Filed 3 Mar 2016

Published

7 Sep 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification23 codes

H05K 3/30
Apparatus or processes for manufacturing printed circuits: assembling printed circuits with electric components, e.g. with resistors
B29C 45/14655
For obtaining an insulating effect, e.g. for electrical components: connected to or mounted on a carrier, e.g. lead frame
B29C 45/372
Mould cavity walls , i.e. the inner surface forming the mould cavity, e.g. linings: provided with means for marking or patterning, e.g. numbering…
H05K 1/0209
Cooling of mounted components: external configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings

Thermal interface adhesion for transfer molded electronic components

Life of this patent

Thermal interface adhesion for transfer molded electronic components

Life of this patent

Abstract

Claims20