Printed circuit board assembly sheet and method for manufacturing the same
AssigneeNitto Denko Corporation
InventorsJun ISHII, Terukazu IHARA, Naohiro TERADA
Life of this patent
Estimating the term…
Abstract
A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
Claims18
A printed circuit board assembly sheet comprising:
- a plurality of printed circuit boards;
- a support frame configured to integrally support the plurality of printed circuit boards such that the plurality of printed circuit boards are arranged at spacings;
- and
- a dummy trace portion provided in a region between at least a printed circuit board on one end side and the support frame, wherein
- each of the plurality of printed circuit boards and the dummy trace portion includes:
- a support substrate;
- a first insulating layer formed on the support substrate;
- a plurality of conductor traces formed on the first insulating layer;
- and
- a second insulating layer formed on the first insulating layer to cover the plurality of conductor traces,
- the support frame has a pair of first frame portions extending in a first direction, and a pair of second frame portions extending in a second direction that is substantially perpendicular to the first direction,
- a first groove extending in the second direction is formed in the first insulating layer in a region between adjacent conductor traces in the dummy trace portion, and
- a second groove extending in the second direction is formed in the second insulating layer in the region between the adjacent conductor traces in the dummy trace portion.
A method of manufacturing a printed circuit board assembly sheet that includes a plurality of printed circuit boards, a support frame configured to integrally support the plurality of printed circuit boards such that the plurality of printed circuit boards are arranged at spacings, and a dummy trace portion provided in a region between at least a printed circuit board on one end side and the support frame, comprising the steps of:
- forming first insulating layers, which correspond to the plurality of printed circuit boards and the dummy trace portion, on a support substrate;
- forming a plurality of conductor traces on each of the first insulating layers corresponding to the plurality of printed circuit boards and the first insulating layer corresponding to the dummy trace portion;
- and
- forming second insulating layers on the first insulating layers to cover the plurality of conductor traces corresponding to the plurality of printed circuit boards and the conductor trace corresponding to the dummy trace portion, respectively, wherein
- the support frame has a pair of first frame portions extending in a first direction, and a pair of second frame portions extending in a second direction that is substantially perpendicular to the first direction,
- a first groove extending in the second direction is formed in the first insulating layer in a region between adjacent conductor traces in the dummy trace portion, and
- a second groove extending in the second direction is formed in the second insulating layer in the region between the adjacent conductor traces in the dummy trace portion.
Dependencies are inferred from the claim text.