Method of manufacturing electronic device

A method of manufacturing an electronic device comprising a panel and a circuit board, the panel having an active area, a first pad area adjacent to the active area, and a second pad area adjacent to the active area, the circuit board comprising a main portion, a first portion connected to the main portion and comprising first pads on one side of the circuit board, and a second portion connected to the main portion, spaced from the first portion on a plane, and comprising second pads on another side of the circuit board, the method comprising:

• placing the panel on a stage;
• aligning the circuit board with the panel such that the first pads of the circuit board are over an upper surface of the panel and face the first pad area and the second pads of the circuit board are below a lower surface of the panel and face the second pad area;
• and
• compressing the first portion of the circuit board to the first pad area of the panel.