Electronic device and method for manufacturing electronic device

A method for manufacturing an electronic device, comprising:

• disposing a flexible substrate on a one surface side of a wiring substrate in which, among a plurality of components having different heights, one or more first components having heights equivalent to or lower than a first height are mounted over a first area of one surface, and among the plurality of components, one or more second components other than the one or more first components are mounted over a second area of the one surface, the flexible substrate including a first portion corresponding to the first area and a second portion corresponding to the second area, the first rigidity of the first portion being higher than a second rigidity of the second portion, such that the first area and the first portion are positioned so as to coincide with each other and such that the second area and the second portion are positioned so as to coincide with each other;
• and
• mounting the flexible substrate, by heating and laminating the flexible substrate, over the wiring substrate on which the plurality of components are mounted.