Method for fabricating ceramic insulator for electronic packaging

A method for fabricating a ceramic insulator for electronic packaging, comprising following steps:

• first, punching holes at positions of bonding pads of a first ceramic layer of a ceramic insulator, metallizing and solidifying the holes, afterwards, printing an upper electric control layer circuit, the upper electric control layer circuit comprises a plurality of metal strips, the metal strips are insulated from and not interconnected with each other, but the metal strips correspond to metal in the holes one to one, and are interconnected with the metal in the holes;
• second, using an underside of the first ceramic layer as a second ceramic layer, punching two groups of holes respectively on two sides of the second ceramic layer corresponding to the holes of the first ceramic layer, metallizing and solidifying the holes of the second ceramic layer, such that the total number of the holes at the two sides of the second ceramic layer is equal to the number of the holes at the first ceramic layer;
• third, printing an upper electroplating circuit layer on an upper surface of the second ceramic layer, the upper electroplating circuit layer comprises a plurality of metal strips, via the printed metal strips, connecting metal in the holes at the two sides of the second ceramic layer one to one with corresponding metal in the holes at the first ceramic layer, the metal strips on the upper surface of the second ceramic layer are insulated from and not interconnected with each other;
• four, an underside of the second ceramic layer being provided with an intermediate ceramic component layer, punching holes on two sides of the intermediate ceramic component layer, metallizing and solidifying the holes, such that positions and the number of the holes at the intermediate ceramic component layer correspond to that of the holes at the second ceramic layer;
• five, an underside of the intermediate ceramic component layer being provided with a third ceramic layer, printing a lower electroplating circuit layer on an upper surface of the third ceramic layer, the lower electrodesposition circuit layer comprises a plurality of metal strips, the metal strips are insulated from and not interconnected with each other;
• connecting the printed metal strips one to one with corresponding metal in the holes of the intermediate ceramic component layer, and making one end of each of the metal strips on the third ceramic layer extend to an edge of the third ceramic layer to form a leading-out terminal, such that electric connections between the third metal strips and device(s) at the exterior of the porcelain can be realized, via the aforesaid steps, forming a built-in electroplating circuit of a raw porcelain.