Apparatus and associated methods for deformable electronics

An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

A method comprising:

• forming an apparatus, the apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

A computer readable medium comprising computer code configured to perform:

• forming an apparatus, the apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via at least one of the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.