US 2017/0257942 A1Published application

Multilayer circuit board

AssigneeMitsubishi Electric Corporation

InventorsShoji KOMATSU, Akimichi HIROTA, Yukihiro TAHARA, Koji SHIBUYA, Yoshihiro AKEBOSHI

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Abstract

A first ground elimination portion 3a formed in a ground layer is formed in a size such that a characteristic impedance determined by the first ground elimination portion 3a and component pads 1a is higher than a characteristic impedance determined by a ground conductor 2a and a transmission line 1b. When an outer shapes of the component pads 1a are projected on the ground layer, the center of a region interposed between the conductor pads 1a is positioned at the center of the first ground elimination portion 3a.

Claims6

Dependent claims

A multilayer circuit board formed by laminating at least one signal layer and at least one ground layer with an insulating layer interposed therebetween, the multilayer circuit board comprising:

a transmission line formed in the signal layer;
at least one conductor pad that is formed in the signal layer and connected to the transmission line, and that is wider than the transmission line;
a ground conductor that is formed in the ground layer, and that has a first ground elimination portion in which a conductor is not disposed;
and
an auxiliary ground conductor that is disposed inside the first ground elimination portion and that is connected to the ground conductor,
wherein the first ground elimination portion is formed in a size such that a characteristic impedance determined by the first ground elimination portion and the at least one conductor pad is higher than a characteristic impedance determined by the ground conductor and the transmission line.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/519,626Filed 6 Jan 2015
Published: 7 Sep 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H05K 1/0253
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: impedance adaptations of transmission lines by special lay-out…
H01P 3/08
With two longitudinal conductors: microstrips; Strip lines
H01P 5/028
Transitions between lines of the same kind and shape, but with different dimensions: between strip lines
H05K 1/0289
Having an universal lay-out, e.g. pad or land grid patterns or mesh patterns: having a matrix lay-out, i.e. having selectively interconnectable…

Family

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