Camera device

A camera device comprising:

• a circuit board (143) which has a first surface and a second surface opposed to each other through a thickness thereof, said circuit board at least partially including a stack of a solder resist (143a), a metallic layer (143b), and a resinous layer (143c) which are laid in this order from a side of the first surface to a side of the second surface;
• an image sensor (144) which is disposed on the first surface of the circuit board;
• an optical member (141) which works to direct light to said image sensor;
• a holder (142) which holds said optical member;
• a recess (147) which is formed in the first surface of said circuit board by omission of portions of said solder resist and said metallic layer so as to expose a portion of the resinous layer to said recess;
• an adhesive agent (16) which achieves attachment between the portion of said resinous layer exposed to said recess and said holder;
• and
• an overflow stopper (148, 150) which is seamlessly formed on a portion of a surface of the solder resist which defines the first surface of said circuit board, said overflow stopper forming at least a portion of said recess.