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US 2017/0257075 A1Published application
Baw device and baw device manufacturing method
AssigneeDisco Corporation
InventorJun Abatake
Life of this patent
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Abstract
A BAW device including a substrate, and a piezoelectric element formed on a front surface of the substrate is provided. The substrate is provided on a back surface side thereof with an acoustic wave diffusion region including a recess formed by partially melting a back surface of the substrate.
Claims2
A bulk acoustic wave device comprising:
- a substrate;
- a piezoelectric element formed on a front surface of the substrate;
- the substrate being provided on a back surface side thereof with an acoustic wave diffusion region including a recess formed by partially melting a back surface of the substrate.
A bulk acoustic wave device manufacturing method for manufacturing a bulk acoustic wave device, the bulk acoustic wave device including
- a substrate,
- a piezoelectric element formed on a front surface of the substrate,
- the substrate being provided on a back surface side thereof with an acoustic wave diffusion region including a recess formed by partially melting a back surface of the substrate, the bulk acoustic wave device manufacturing method comprising:
- a substrate preparation step of preparing the substrate formed on the front surface thereof with the piezoelectric element;
- and
- an acoustic wave diffusion region forming step of applying a laser beam having such a wavelength as to be absorbed in the substrate from the back surface side of the substrate, to partially melt the back surface of the substrate, thereby forming an acoustic wave diffusion region including a recess.
3 more elements
Dependencies are inferred from the claim text.